About Me

I am a research engineer with a Ph.D. in Computer Graphics from the University of California, Santa Barbara, where I was mentored by Professor Ted Kim. My expertise lies in computational graphics, simulation, and optimization, with a focus on developing scalable solutions that address industry challenges.

As the lead inventor of the SSP (Scalable Spectral Packing) technology, I have guided its research and development across industries including 3D printing, robotics, and manufacturing. SSP has been successfully deployed for clients to optimize workflows and reduce costs. One highlight is the publication "Dense, Interlocking-Free and Scalable Spectral Packing of Generic 3D Objects", presented at SIGGRAPH 2023 and covered by major outlets such as MIT News, Yahoo, and Voxelmatters.

My research spans physically based animation, geometry processing, and shape analysis, where I have developed efficient spectral methods for 3D packing and smoke simulation.

Beyond research, I contribute to education as a Software Development Fellow at the Open Avenues Foundation, where I design and teach courses on computer graphics that focus on WebGL and Three.js.

Experience

Research Engineer, Inkbit (Oct 2021 - Present)
I collaborate with Professor Wojciech Matusik and Dr. Desai Chen.
Software Development Fellow, Open Avenues Foundation (Oct 2023 - Present)
I design and teach an eight-week course on computer graphics focused on WebGL and Three.js development. I mentor students in career development and provide guidance on interview strategies.
Postdoctoral Associate, Yale Computer Graphics Group (Sep 2020 - Sep 2021)
Ph.D. Student, University of California, Santa Barbara (Sep 2015 - Jul 2020)

Commercialization and Technology Transfer

I spearhead the research and development of software products derived from SSP technology, including the following offerings:

Inkbit Construct is Inkbit's proprietary build preparation tool that leverages SSP to streamline 3D printing operations. It significantly reduces manual labor in build preparation and boosts printer throughput by up to 30%.

Fitting Pack, developed for a leading candy and toy manufacturer, ensures toys fit into designated containers while incorporating digital safety checks. It achieved substantial time and cost savings by largely replacing the client's manual processes with digital automation.

Flex Pack, designed for IMA, a global leader in box-on-demand machines, selects optimal box sizes for cutting machines to reduce shipping costs. It also analyzes client order histories to configure boxes for the machines, yielding greater savings.

SSP in Synera brings SSP to the Synera marketplace through our ongoing collaboration. Our goal is to make build preparation for additive manufacturing more accessible and cost-effective for a broader range of companies.

SSP for Robotics Packing is an evaluation project conducted with a major e-commerce company. We integrated SSP into Nvidia Isaac Sim to develop a robotic box-packing simulation, and during testing, our solution outperformed the company's existing system.

These products have generated significant additional revenue for Inkbit while delivering transformative solutions for our partners and clients. Please visit https://inkbit3d.com/packing/ for more details.