About Me

I am a research engineer with a Ph.D. in Computer Graphics from the University of California, Santa Barbara, where I was mentored by Professor Ted Kim. My expertise lies in computational graphics, simulation, and optimization, with a focus on developing scalable solutions that address industry challenges.

As the main inventor to SSP (Scalable Spectral Packing) technology, I have led its research and development across diverse industries such as 3D printing, robotics, and manufacturing. SSP has been successfully deployed to our clients to optimize their workflows and reduce costs. One highlight of that is the publication "Dense, Interlocking-Free and Scalable Spectral Packing of Generic 3D Objects", presented at SIGGRAPH 2023 and covered by major outlets such as MIT News, Yahoo, and Voxelmatters.

My research spans physically based animation, geometry processing, and shape analysis, where I have developed efficient spectral methods for 3D packing and smoke simulation.

Beyond research, I contribute to education as a Software Development Fellow at the Open Avenues Foundation, where I design and teach courses on computer graphics, focusing on WebGL and Three.js.

Experience

Research Engineer, Inkbit (Oct 2021 - Present)
Working with Professor Wojciech Matusik and Dr. Desai Chen.
Software Development Fellow, Open Avenues Foundation (Oct 2023 - Present)
Design and teach an 8-week course on computer graphics, focusing on WebGL and Three.js development. Mentored students in career development and provided guidance on interview strategies
Postdoctoral Associate, Yale Computer Graphics Group (Sep 2020 - Sep 2021)
Ph.D. Student, University of California, Santa Barbara (Sep 2015 - Jul 2020)

Commercialization and Technology Transfer

I spearhead the research and development of software products derived from the SSP technology with the following products:

Inkbit Construct This is Inkbit's proprietary build preparation tool leverages SSP to streamline 3D printing operations. It significantly reduces manual labor with the build preparation and boosting printer throughput by up to 30%.

Fitting Pack Developed for a leading candy and toy manufacturer, this tool ensures toys fit into designated containers while incorporating digital safety checks. It achieved substantial time and cost savings by largely replacing client's manual processes with digital automation.

Flex Pack Designed for IMA , a global leader in box-on-demand machines, this software selects optimal box sizes for cutting machines, reducing shipping costs. It also analyzes client order histories to config boxes for the machine, achieving greater savings.

SSP in Synera We collaborate with Synera to bring SSP into the Synera marketplace. We aim to make build preparation for additive manufacturing more accessible and cost-effective for a broader range of companies.

SSP for Robotics Packing This evaluation project was conducted in collaboration with a major e-commerce company. We integrated SSP into Nvidia Isaac Sim to develop a robotic box-packing simulation. During the evaluation, our solution outperformed the company's existing system.

These products have generated significant additional revenue for Inkbit while delivering transformative solutions for our partners and clients. Please visit https://inkbit3d.com/packing/ for more details.